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Master’sParticipation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.

SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship

Last verified 10 November 2026 by the Scholarships for Africans editorial team

Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.. Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence.

Provider
USN / Aalto University / BME / European Union
Host country
Norway / Finland / Hungary
Deadline
10 January 2027; closing hour not stated

Eligibility & requirements at a glance

Review the recorded eligibility, funding and deadline information below. Confirm the current award conditions on the provider's official source.

Who can apply
Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.
Funding
Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.
Study level
Master’s
Deadline
10 January 2027; closing hour not stated

Key eligibility criteria

  • Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.

Recorded funding information

  • Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.

About the SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship (2026)

**Funding:** Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included. **Who can apply:** Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. **Conditions:** Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline. **How to apply:** Apply through the official USN route and supply degree records, English evidence, CV, two references and the scholarship declaration. **Deadline:** 10 January 2027; closing hour not stated **Cycle:** 2027–2029 Always confirm details on the official page before applying.

Funding information

The funding information below is recorded in this listing; it does not establish additional covered components. Check amounts, caps, exclusions and conditions on the official source.

  • Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.

SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship eligibility

Always cross-check eligibility against the sponsor's official site before applying — sponsor rules can change between intakes.

  • Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.

SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship document information

No explicit document checklist is recorded here. If an application is required, prepare only the materials the provider requests.

    How to apply for the SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship 2026

    Follow the provider's stated process. The checks below are guidance, not additional application requirements. Any original editorial instructions remain in the description above.

    1. 1
      Listed application information

      ** Apply through the official USN route and supply degree records, English evidence, CV, two references and the scholarship declaration.

    2. 2
      Check the provider's process

      Consult https://www.usn.no/english/academics/semiconductor-chips-integration-and-innovation/ to confirm whether consideration is automatic or requires an application, and follow only the process stated there.

    3. 3
      Check eligibility and any requested materials

      Listed eligibility: Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.. Confirm the current criteria and, if submission is required, use the provider's own checklist.

    4. 4
      Check dates and next steps

      Listed deadline information: 10 January 2027; closing hour not stated. Confirm any cutoff, time zone and follow-up process with the provider.

    SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship deadline & application timeline

    Provider deadline information: 10 January 2027; closing hour not stated. This text cannot be safely converted to a countdown; check the official source for its meaning. The earlier milestones are optional planning suggestions only.

    1. Planning suggestion: 12 months out

      Check the current call and decide whether this opportunity fits your plans.

    2. Planning suggestion: 6 months out

      If the provider requires tests or documents that take time, plan for them using its published instructions.

    3. Planning suggestion: 3 months out

      If an application is required, review the provider's process and prepare only the materials it requests.

    4. Planning suggestion: 1 month out

      If submission is required, allow time to check your materials and any stated cutoff.

    5. Provider deadline
      10 January 2027; closing hour not stated

      Provider deadline information: 10 January 2027; closing hour not stated. Confirm the current instructions and any cutoff or time zone on the official source; no additional time is assumed here.

    Ready to apply?

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    Editorial verification note

    Official page rechecked 10 Nov 2026 (batch 01). Fixed deadline confirmed on page.
    Last checked 11/10/2026

    Frequently asked questions

    Who can apply for the SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship?+

    Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.

    What funding does the SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship offer?+

    Listed funding: Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.. Confirm amounts, exclusions and conditions on the official source. This label does not establish any additional benefit components.

    When is the application deadline?+

    Provider deadline information: 10 January 2027; closing hour not stated. Confirm the current cutoff and any time zone on the official source; no additional cutoff or late-submission policy is assumed here.

    What documents do I need to apply?+

    No explicit document checklist is recorded here. If an application is required, prepare only the documents requested by the provider; requirements may differ from admission requirements.

    How do I check the application process?+

    ** Apply through the official USN route and supply degree records, English evidence, CV, two references and the scholarship declaration. Consult https://www.usn.no/english/academics/semiconductor-chips-integration-and-innovation/ to confirm whether consideration is automatic or requires an application, and follow only the process stated there. Listed eligibility: Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.. Confirm the current criteria and, if submission is required, use the provider's own checklist. Listed deadline information: 10 January 2027; closing hour not stated. Confirm any cutoff, time zone and follow-up process with the provider.

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