SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship
Last verified 10 November 2026 by the Scholarships for Africans editorial team
Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.. Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence.
- Provider
- USN / Aalto University / BME / European Union
- Host country
- Norway / Finland / Hungary
- Deadline
- 10 January 2027; closing hour not stated
Eligibility & requirements at a glance
Review the recorded eligibility, funding and deadline information below. Confirm the current award conditions on the provider's official source.
- Who can apply
- Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.
- Funding
- Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.
- Study level
- Master’s
- Deadline
- 10 January 2027; closing hour not stated
Key eligibility criteria
- Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.
Recorded funding information
- Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.
About the SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship (2026)
Funding information
The funding information below is recorded in this listing; it does not establish additional covered components. Check amounts, caps, exclusions and conditions on the official source.
- Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.
SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship eligibility
Always cross-check eligibility against the sponsor's official site before applying — sponsor rules can change between intakes.
- Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.
SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship document information
No explicit document checklist is recorded here. If an application is required, prepare only the materials the provider requests.
How to apply for the SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship 2026
Follow the provider's stated process. The checks below are guidance, not additional application requirements. Any original editorial instructions remain in the description above.
- 1Listed application information
** Apply through the official USN route and supply degree records, English evidence, CV, two references and the scholarship declaration.
- 2Check the provider's process
Consult https://www.usn.no/english/academics/semiconductor-chips-integration-and-innovation/ to confirm whether consideration is automatic or requires an application, and follow only the process stated there.
- 3Check eligibility and any requested materials
Listed eligibility: Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.. Confirm the current criteria and, if submission is required, use the provider's own checklist.
- 4Check dates and next steps
Listed deadline information: 10 January 2027; closing hour not stated. Confirm any cutoff, time zone and follow-up process with the provider.
SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship deadline & application timeline
Provider deadline information: 10 January 2027; closing hour not stated. This text cannot be safely converted to a countdown; check the official source for its meaning. The earlier milestones are optional planning suggestions only.
- Planning suggestion: 12 months out
Check the current call and decide whether this opportunity fits your plans.
- Planning suggestion: 6 months out
If the provider requires tests or documents that take time, plan for them using its published instructions.
- Planning suggestion: 3 months out
If an application is required, review the provider's process and prepare only the materials it requests.
- Planning suggestion: 1 month out
If submission is required, allow time to check your materials and any stated cutoff.
- Provider deadline10 January 2027; closing hour not stated
Provider deadline information: 10 January 2027; closing hour not stated. Confirm the current instructions and any cutoff or time zone on the official source; no additional time is assumed here.
Ready to apply?
Cross-check the latest eligibility rules and deadline on the sponsor's official portal before you start your application.
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Frequently asked questions
Who can apply for the SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship?+
Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.
What funding does the SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship offer?+
Listed funding: Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.. Confirm amounts, exclusions and conditions on the official source. This label does not establish any additional benefit components.
When is the application deadline?+
Provider deadline information: 10 January 2027; closing hour not stated. Confirm the current cutoff and any time zone on the official source; no additional cutoff or late-submission policy is assumed here.
What documents do I need to apply?+
No explicit document checklist is recorded here. If an application is required, prepare only the documents requested by the provider; requirements may differ from admission requirements.
How do I check the application process?+
** Apply through the official USN route and supply degree records, English evidence, CV, two references and the scholarship declaration. Consult https://www.usn.no/english/academics/semiconductor-chips-integration-and-innovation/ to confirm whether consideration is automatic or requires an application, and follow only the process stated there. Listed eligibility: Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.. Confirm the current criteria and, if submission is required, use the provider's own checklist. Listed deadline information: 10 January 2027; closing hour not stated. Confirm any cutoff, time zone and follow-up process with the provider.
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