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Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included.Master’s

SSI2 Semiconductor Chips Integration and Innovation Erasmus Mundus Scholarship

Bailleur
USN / Aalto University / BME / European Union
Destination
Norway / Finland / Hungary
Niveau d'études
Master’s
Date limite
Candidature en continu / date à confirmer
Candidater sur le site officiel

La candidature se fait toujours directement chez le bailleur. Nous ne collectons aucun dossier et ne demandons jamais de frais.

Critères d'éligibilité

Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline.

Présentation du programme

**Funding:** Participation/tuition fees waived; EUR 1,400/month subsistence for the programme; mandatory insurance included. **Who can apply:** Worldwide applicants with a relevant 180-ECTS-equivalent bachelor’s, strong grades, basic electronics coursework and the specified English evidence. **Conditions:** Scholarship selection is competitive; prior-scholarship declaration required. Non-EU applicants use the January deadline. **How to apply:** Apply through the official USN route and supply degree records, English evidence, CV, two references and the scholarship declaration. **Deadline:** 10 January 2027; closing hour not stated **Cycle:** 2027–2029 Always confirm details on the official page before applying.

Le descriptif détaillé du bailleur reste en anglais, car c'est la langue du dossier de candidature.

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Les dates et montants peuvent changer. Confirmez toujours sur le lien officiel avant de candidater.